In the Electronics Design Center at Case School of Engineering at Case Western Reserve University, we offer a range of equipment and capabilities you can pursue.
The EDC has approximately 15 tools used primarily for producing thin film and thick film microfabricated devices. Three clean rooms house equipment for sputtering, photolithography and thick film printing. Adjacent to the clean rooms are instruments for laser cutting, dicing and metrology. A user can progress from concept to final device all within the center. 

The EDC offers the following services:

• Metal sputtering including Au, Ag, Cu, Ir, Pt, Pd, Ru, W
• Insulator sputtering including SiO2, SiC, BN, Al2O3
• Fabrication clean room
• Wafer dicing
• Thick film printing
• Four-point probe measurement system
• Laser cutting of thin plastics

If you have questions or would like to get started, we encourage you to contact us.

Equipment and Capabilities

Metal and Insulator Deposition

• Denton Vacuum Discovery 18 DC Sputtering System
• Denton Vacuum Explorer 14 RF Sputtering System
• Denton Vacuum Explorer 14 DC & RF Sputtering System 
• Targets: Ag, Al2O3, Al, Au, C, Cr, Cu, Ir, Ni, Pb, Pd, Pt, Ru, SiO2, Ta, Ti, W, and many more 

Photolithography Equipment

• Laurell Technologies Programmable High Torque Spin Coater 
• Laurell Technologies Programmable Spin Coater
• ABM Photomask Aligner 
• Torrey Pines Programmable Hot Plate, Data Plate Hot Plate

Thick Film Deposition

• MPM TF-100 Screen Printer
• Asymtek Century C730 Coating System
• Parker Automation Picosprintzer
• Sonoplotter GIX Microplotter

Additional Equipment

• Lucas Labs Four-Point Probe Resistivity Measurement System
• DISCO DAD3350 Wafer Dicing Saw
• ULS Versa 2.30 Cutting & Marking Laser 
• Unitek Spot Welder